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By D. A. Beck (auth.), Gerald A. Walker (eds.)

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Read or Download Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado PDF

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Extra info for Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

Sample text

A. Beck 18 conditions these features make it the best material to use. Generally speaking, however, it is the lazy designer's material. Titanium is extremely useful from a corrosion standpOint if this attribute is of extreme importance. In deep sea applications, where stainless steel or other materials are not good from a corrosion standpOint, titanium can and should be more widely used. Also in the intermediate temperature range of 700 to 800°F it can have some useful applications. As most of you know, however, titanium must be welded in an inert atmosphere or at least have heavy inert gas shielding during the welding process.

42 J. Quant package designer, taking this factor into account, shoUld assign work only to experienced potting organizations. 2. Because of the thermal insulating nature of the microballoon filler, the cure exotherm frequently reaches a peak of 190°F. Furthermore, processing characteristics presently preclude the possibility of a reasonably short-time, low-temperature cure for thermally sensitive components, as is possible with general-purpose systems. APPLICATIONS With careful design consideration, this resin system can be incorporated into electronic packages of the type that are currently being encapsulated with the more familiar filled resins.

D-45 Primary sources Union Carbide Chemicals Co. 2770 Leonis Boulevard Los Angeles, California Dow Chemical Company Midland, Michigan Secondary sources Distillation Products Industries Division Eastman Kodak Company Rochester 3, New York Fisher Scientific Company 2850 S. Jefferson Street St. 1 Par Industries, Inc. 2193 E. 2 The ingredients of this encapsulating compound may be toxic. Hence, adequate ventilation should be provided in the handling ofthese materials to prevent undue exposure. Ingestion or skin contact with these materials shall be avoided.

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